Reballing Technology
With advancing miniaturization and integration density of electronic assemblies, high pin count packages for integrated circuits are increasingly used e.g. in form of BGA, CSP and QFN. Assembly faults might be possible during the processing of these components caused by different factors. Due to partly very expensive components or pre-assembled PCB´s, it is worth ro re-use it, meaning recycling via component exchange or reballing of the high pin count components.
RHe offers this service within various repair technologies. Possible is a reballing of components with solder balls.
The following two repair technologies could be used:
- A first option is the repair of an assembled board by removing of the defective BGA´s and a re-soldering of a new component to the assembly after cleaning.
- Another variant is the recovery of expensive BGA´s or other high pin count package types from defective boards. The first step is a desoldering of the component from the PCB or hybrid circuit board using a repair solder station. The next step will be the removal of the "defective" solder balls. It follows a cleaning of the BGA. Finally, the new balls will be soldered carefully and safely in a pre-programmed solder profile with the aid of a special ball mask.
All these repair or reballing technologies serve the cost control or reduction and flexibility as well as rapidness in a prototyping or pre-series phase.
Technical Parameters:
Ball-alloy: Sn96.5Ag3Cu0.5 or rather Sn63Pb37
Ball-diameter: 300um to 762 um
Ball-quantity: e.g. BGA size 78x78mm, Ball size: 0,6mm, Pitch size: 1,0mm, Ball quantity: 1936 pcs
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