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WAFER SAWING
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DICING SERVICE FOR
WAFERS UND CERAMICS
Materials
- aluminium oxide
- aluminium nitride
- PZT-ceramics
- quartz glass
- glass
- silicon
- other material on request
Wafer dimensions
Wafer thickness
- min. 200 µm (under it on request)
- max. 750 µm
Dicing channel
- silicon: min. 75 µm
- other: min. 100 µm
Chipping
- silicon: max. 10 µm
- other: max. 50 µm
Tape
- standard: 150 µm UV-Tape
- blue tape
Delivery form
- on tape/frame
- waffle pack
Anwendung
- rapid prototyping
- handling of small lots
REMARKS
The dicing channel should be free of metallisation. It is not possible to saw the wafer in proper form if electroplated metallization with a thickness above 1 µm exists in the dicing channel. |
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