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PACKAGING |
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Specific packages are required for special applications in the aerospace sectors or in other areas where harsh environmental conditions prevail. To protect the components or the circuit boards from environmental influences, individually matched technologies are used ranging from simple coverings to special hermetic packages.
RHe is able to perform this sealing to deliver hybrids in hermetically sealed packages. This package seal is produced using a resistance welding process under a nitrogen atmosphere. The hermeticity is guaranteed through a final gross and fine leak test. The selective hermetisation of thin and thick film circuits developed by RHe could be a weight-saving alternative to a complete package.
Overview of the component or circuit protection / packaging possibilities:
- Screen printed polymer
- Glob-Top
- Conformal coating
- Hermetic packaging (flatpack, plug-in, ceramic) using parallel seam sealer
- Customised BGA
details on this technology |
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