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ASSEMBLY |
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As a specialist in the field of hybrid technology, RHe is always able to assemble all the most up-to-date components in-house. This refers primarily to the assembly of SMD or through-hole components, Flip-Chips, BGAs and bare dice including MMICs. Modern machines as well as different die attach and wire bonding equipment are available to mount the components.
To ensure a maximum level of flexibility the chip assembly can be carried out by adhesive bonding, soldering or eutectic bonding. RHe can perform the wire bonding using the ultrasonic or thermo-sonic procedure with a wire diameter of 12.5 to 500 µm. For special high-frequency applications ribbons can be used. The electrical interface of the assemblies can be realised via standard lead frames, individual connection wires, sockets/plugs or other connectors.
details on this technology |
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